Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

TSMC (TSM.US) ’s CoWoS is rumored to have faced order cuts and slackened production expansion, according to multiple media ...

Changing its Blackwell architectural plan, Nvidia ( NVDA, Financials) is reordering its product line and supply chain focus.

Nvidia's (NASDAQ:NVDA) latest Blackwell lineup suggests it will reduce demand for CoWoS-S from Taiwan Semiconductor ...

This new generation of TSMC's CoWoS ™ test vehicles added a silicon proof point demonstrating the integration of a logic SoC chip and DRAM into a single module using the Wide I/O interface. TSMC's ...

TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow recovery in ...

Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS® Platform with 7.2 Gbps HBM3 ...