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THE CHOSUNILBO on MSNSamsung’s memory chip leadership at risk as China’s CXMT, YMTC close inChinese chipmakers ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are closing in on South Korea’s ...
Samsung has introduced its upcoming 10th-generation V-NAND flash memory with over 400 active layers and a 5.6 GT/s interface ...
The new 3D flash memory also ramps up density, with up to 332 memory layers, improving bit density by 59% over ...
Sandisk has unveiled High Bandwidth Flash (HBF) for AI workloads which will have a major impact on the $100 billion HBM ...
Resistive RAM claims to be ideal for consolidating both code storage and data logging in a single external memory.
SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...
Western Digital and new CEO Irving Tan will focus on the hard drive business, while Sandisk under CEO David Goeckeler will ...
Three new microcontrollers (MCUs) are joining STMicroelectronics’ STM32C0 series, giving designers more flexibility with ...
Companies Preview 10 th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density SAN FRANCISCO--(BUSINESS WIRE)--Kioxia Corporation and ...
The oversupply of NAND flash has forced memory chipmakers to implement production cuts in response to lower-than-expected orders from PC and smartphone manufacturers. Major players in ...
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